Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9833980 | Securing mechanism and method for wafer bonder | David J. Zapp | 2017-12-05 |
| 9799507 | Devices and methodologies to clean wafers with solvent | David J. Zapp | 2017-10-24 |
| 9576838 | Devices for methodologies related to wafer carriers | Elena Becerra Woodard, Daniel Kwadwo Amponsah Berkoh, David J. Zapp, Hyong-yong Lee, Daniel Eduardo Sanchez +1 more | 2017-02-21 |
| 9539801 | Debonders with a recess and a side wall opening for semiconductor fabrication | David J. Zapp, Daniel Eduardo Sanchez, Hung V. Phan, Hyong-yong Lee | 2017-01-10 |
| 9533484 | Debonders with a recess and a heater for semiconductor fabrication | David J. Zapp, Daniel Eduardo Sanchez, Hung V. Phan, Hyong-yong Lee | 2017-01-03 |