Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711364 | Methods for etching through-wafer vias in a wafer | Daniel Kwadwo Amponsah Berkoh, Dean G. Scott | 2017-07-18 |
| 9576838 | Devices for methodologies related to wafer carriers | Daniel Kwadwo Amponsah Berkoh, David J. Zapp, Steve Canale, Hyong-yong Lee, Daniel Eduardo Sanchez +1 more | 2017-02-21 |