Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9716017 | Semiconductor packages including interposer and methods of manufacturing the same | Seung Taek YANG | 2017-07-25 |
| 9570370 | Multi chip package and method for manufacturing the same | Jong Hoon Kim, Ho Young SON, Jeong-Hwan Lee | 2017-02-14 |