Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9793217 | Package-on-package type semiconductor device which is realized through applying not a TSV technology but a fan-out wafer level package technology | Sang Eun Lee | 2017-10-17 |
| 9716017 | Semiconductor packages including interposer and methods of manufacturing the same | Tac Keun OH | 2017-07-25 |