Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9673151 | Semiconductor package having metal layer | Chih-Hsien Chiu, Hao-Ju Fang, Cho-Hsin Chang, Tsung-Hsien Tsai, Chia-Yang Chen +1 more | 2017-06-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9673151 | Semiconductor package having metal layer | Chih-Hsien Chiu, Hao-Ju Fang, Cho-Hsin Chang, Tsung-Hsien Tsai, Chia-Yang Chen +1 more | 2017-06-06 |