Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9673151 | Semiconductor package having metal layer | Hao-Ju Fang, Hsin-Lung Chung, Cho-Hsin Chang, Tsung-Hsien Tsai, Chia-Yang Chen +1 more | 2017-06-06 |
| 9627748 | Electronic component | Heng-Cheng Chu, Cheng-Yu Chiang | 2017-04-18 |