Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812678 | Molding packaging material | Honglin Wang | 2017-11-07 |
| 9662858 | Molding packaging material and battery case | Tetsunobu Kuramoto | 2017-05-30 |
| 9649827 | Molding packaging material and molded case | Honglin Wang | 2017-05-16 |
| 9553284 | Molding material for package | Honglin Wang | 2017-01-24 |