HW

Honglin Wang

SC Showa Denko Packaging Co.: 3 patents #2 of 4Top 50%
Overall (2017): #46,432 of 506,227Top 10%
4
Patents 2017

Issued Patents 2017

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
9812678 Molding packaging material Yuji MINAMIBORI 2017-11-07
9725482 Pentacyclic triterpenoid compound with modified structure and preparation method and use thereof 2017-08-08
9649827 Molding packaging material and molded case Yuji MINAMIBORI 2017-05-16
9553284 Molding material for package Yuji MINAMIBORI 2017-01-24