Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9825081 | Semiconductor devices having a pad structure | Taeseok Oh, Junetaeg Lee, Jaesang YOO | 2017-11-21 |
| 9728572 | Via structures including etch-delay structures and semiconductor devices having via plugs | Byung-Jun Park, Chang-Rok Moon, Seong-Ho Oh, Tae-Seok Oh, June-Taeg Lee | 2017-08-08 |
| 9608026 | Through via structure, methods of forming the same | Byung-Jun Park | 2017-03-28 |