Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728572 | Via structures including etch-delay structures and semiconductor devices having via plugs | Chang-Rok Moon, Seung-Hun Shin, Seong-Ho Oh, Tae-Seok Oh, June-Taeg Lee | 2017-08-08 |
| 9608026 | Through via structure, methods of forming the same | Seung-Hun Shin | 2017-03-28 |