Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9850390 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device prepared using the same | Jin Min CHEON, Ki Hyeok KWON, Joo Young Chung, Jin Woo CHOI, Seung Hun Han | 2017-12-26 |
| 9695294 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same | Seung Woo Han, Hwan-Sung Cheon | 2017-07-04 |
| 9606438 | Resist underlayer composition, method of forming patterns, and semiconductor integrated circuit device including the pattern | Hyo-Young Kwon, Jun Ho Lee, Hwan-Sung Cheon | 2017-03-28 |