Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9661739 | Electronic modules having grounded electromagnetic shields | Donald Joseph Leahy, Brian D. Sawyer, Stephen Parker | 2017-05-23 |
| 9646857 | Low pressure encapsulant for size-reduced semiconductor package | Howard Terry Glascock, Frank J. Juskey, Charles E. Carpenter, Robert Hartmann | 2017-05-09 |
| 9613831 | Encapsulated dies with enhanced thermal performance | David Jandzinski, Stephen Parker, Jon Chadwick, Julio C. Costa | 2017-04-04 |