Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9824951 | Printed circuit module having semiconductor device with a polymer substrate and methods of manufacturing the same | Dirk Robert Walter Leipold, Baker Scott | 2017-11-21 |
| 9812350 | Method of manufacture for a silicon-on-plastic semiconductor device with interfacial adhesion layer | — | 2017-11-07 |
| 9806192 | Suppression of back-gate transistors in RF CMOS switches built on an SOI substrate | Philip W. Mason, Michael Carroll, Jan Edward Vandemeer, Daniel Charles Kerr | 2017-10-31 |
| 9613831 | Encapsulated dies with enhanced thermal performance | Thomas Scott Morris, David Jandzinski, Stephen Parker, Jon Chadwick | 2017-04-04 |
| 9583414 | Silicon-on-plastic semiconductor device and method of making the same | David M. Shuttleworth, Michael J. Antonell | 2017-02-28 |