Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799637 | Semiconductor package with lid having lid conductive structure | Brian P. Balut, Jonathan J. Fain, Kevin J. Anderson | 2017-10-24 |
| 9793237 | Hollow-cavity flip-chip package with reinforced interconnects and process for making the same | Kevin J. Anderson | 2017-10-17 |
| 9721867 | Graphene heat dissipating structure | Cody M. Washburn, Timothy N. Lambert, David R. Wheeler, Christopher T. Rodenbeck | 2017-08-01 |
| 9659898 | Apparatuses, systems, and methods for die attach coatings for semiconductor packages | Kevin J. Anderson, Walid M. Meliane, John Beall | 2017-05-23 |
| 9589864 | Substrate with embedded sintered heat spreader and process for making the same | — | 2017-03-07 |
| 9585240 | Advanced grounding scheme | Thomas R. Landon, Jr., Paul D. Bantz | 2017-02-28 |
| 9559034 | Package for high-power semiconductor devices | Deep C. Dumka | 2017-01-31 |