Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799637 | Semiconductor package with lid having lid conductive structure | Brian P. Balut, Jonathan J. Fain, Tarak A. Railkar | 2017-10-24 |
| 9793237 | Hollow-cavity flip-chip package with reinforced interconnects and process for making the same | Tarak A. Railkar | 2017-10-17 |
| 9659898 | Apparatuses, systems, and methods for die attach coatings for semiconductor packages | Tarak A. Railkar, Walid M. Meliane, John Beall | 2017-05-23 |