Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831219 | Manufacturing method of package structure | Yong-Cheng Chuang, Kuo-Ting Lin, Chia-Jen Chou | 2017-11-28 |
| 9825010 | Stacked chip package structure and manufacturing method thereof | Ji-Cheng Lin, Che-Min Chu, Chun-Te Lin, Chien-Wen Huang | 2017-11-21 |
| 9761568 | Thin fan-out multi-chip stacked packages and the method for manufacturing the same | Chia-Wei Chang, Kuo-Ting Lin, Yong-Cheng Chuang | 2017-09-12 |
| 9659911 | Package structure and manufacturing method thereof | Chia-Wei Chang, Kuo-Ting Lin, Yong-Cheng Chuang | 2017-05-23 |