Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9825010 | Stacked chip package structure and manufacturing method thereof | Li-Chih Fang, Ji-Cheng Lin, Che-Min Chu, Chien-Wen Huang | 2017-11-21 |
| 9618990 | Electronic device and power management method thereof | Shih-Chin Lu, Chung-Chi Tsou | 2017-04-11 |