Issued Patents 2017
Showing 25 most recent of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831141 | Integrated circuit containing DOEs of GATE-snake-open-configured, NCEM-enabled fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-11-28 |
| 9825018 | Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including tip-to-tip short configured fill cells, and the second DOE including chamfer short configured fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-11-21 |
| 9818738 | Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells with first DOE including tip-to-side short configured fill cells and second DOE including chamfer short configured fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-11-14 |
| 9818660 | Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including via open configured fill cells, and the second DOE including metal island open configured fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-11-14 |
| 9805994 | Mesh-style NCEM pads, and process for making semiconductor dies, chips, and wafers using in-line measurements from such pads | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-10-31 |
| 9799640 | Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including chamfer short configured fill cells, and the second DOE including corner short configured fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-10-24 |
| 9799575 | Integrated circuit containing DOEs of NCEM-enabled fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-10-24 |
| 9793253 | Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least Via-open-configured, AACNT-short-configured, GATE-short-configured, and TS-short-configured NCEM-enabled fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-10-17 |
| 9786650 | Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including snake open configured fill cells, and the second DOE including metal island open configured fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-10-10 |
| 9786649 | Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including via open configured fill cells, and the second DOE including stitch open configured fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-10-10 |
| 9786648 | Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least chamfer-short-configured, AACNT-short-configured, GATECNT-short-configured, and TS-short-configured, NCEM-enabled fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-10-10 |
| 9785496 | Process for making semiconductor dies, chips, and wafers using non-contact measurements obtained from DOEs of NCEM-enabled fill cells on wafers that include multiple steps for enabling NC detecteion of AACNT-TS via opens | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-10-10 |
| 9778974 | Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including snake open configured fill cells, and the second DOE including metal island open configured fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-10-03 |
| 9780083 | Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, TS-short-configured, metal-short configured, and AA-short-configured, NCEM-enabled fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-10-03 |
| 9773774 | Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including chamfer short configured fill cells, and the second DOE including corner short configured fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-09-26 |
| 9773775 | Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including merged-via open configured fill cells, and the second DOE including snake open configured fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-09-26 |
| 9773773 | Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least chamfer-short-configured, AACNT-short-configured, GATE-short-configured, and GATECNT-short-configured, NCEM-enabled fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-09-26 |
| 9768083 | Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including merged-via open configured fill cells, and the second DOE including snake open configured fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-09-19 |
| 9766970 | Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including merged-via open configured fill cells, and the second DOE including metal island open configured fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-09-19 |
| 9768156 | Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including side-to-side short configured fill cells, and the second DOE including chamfer short configured fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-09-19 |
| 9761575 | Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least chamfer-short-configured, AACNT-short-configured, GATE-short-configured, and TS-short-configured, NCEM-enabled fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-09-12 |
| 9761574 | Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, GATECNT-short-configured, metal-short-configured, and AA-short-configured, NCEM-enabled fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-09-12 |
| 9761573 | Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, AACNT-short-configured, GATE-short-configured, and TS-short-configured, NCEM-enabled fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-09-12 |
| 9761502 | Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including via open configured fill cells, and the second DOE including merged-via configured fill cells | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-09-12 |
| 9748153 | Process for making and using a semiconductor wafer containing first and second does of standard cell compatible, NCEM-enabled fill cells, with the first DOE including side-to-side short configured fill cells, and the second DOE including tip-to-side short configure | Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more | 2017-08-29 |