Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9708468 | Thermosetting resin composition, prepreg, metal clad laminate plate, and printed wiring board | Hiroaki Fujiwara, Hirosuke SAITO | 2017-07-18 |
| 9637598 | Method of curing thermosetting resin composition, thermosetting resin composition, and prepreg, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used | Hiroaki Fujiwara, Hirosuke SAITO | 2017-05-02 |
| 9567481 | Resin composition, resin varnish, prepreg, metal-clad laminate and printed wiring board | Hirosuke SAITO, Hiroaki Fujiwara | 2017-02-14 |