Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9795033 | Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same | Shingo Yoshioka | 2017-10-17 |
| 9708468 | Thermosetting resin composition, prepreg, metal clad laminate plate, and printed wiring board | Yuki Kitai, Hirosuke SAITO | 2017-07-18 |
| 9637598 | Method of curing thermosetting resin composition, thermosetting resin composition, and prepreg, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used | Yuki Kitai, Hirosuke SAITO | 2017-05-02 |
| 9567481 | Resin composition, resin varnish, prepreg, metal-clad laminate and printed wiring board | Hirosuke SAITO, Yuki Kitai | 2017-02-14 |