Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9704784 | Method of integrating a copper plating process in a through-substrate-via (TSV) on CMOS wafer | Matthieu Lagouge, Qing Zhang, Gul Zeb | 2017-07-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9704784 | Method of integrating a copper plating process in a through-substrate-via (TSV) on CMOS wafer | Matthieu Lagouge, Qing Zhang, Gul Zeb | 2017-07-11 |