Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9704784 | Method of integrating a copper plating process in a through-substrate-via (TSV) on CMOS wafer | Qing Zhang, Mohommad Choudhuri, Gul Zeb | 2017-07-11 |
| 9586812 | Device with vertically integrated sensors and method of fabrication | Mamur Chowdhury | 2017-03-07 |