Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9583676 | Low warpage wafer bonding through use of slotted substrates | Marc Andre De Samber, Roy Antoin Bastiaan Engelen | 2017-02-28 |
EG
Eric Cornelis Egbertus Van Grunsven
Overall (2017): #428,265 of 506,227Top 85%
1
Patents 2017