Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9583676 | Low warpage wafer bonding through use of slotted substrates | Marc Andre De Samber, Eric Cornelis Egbertus Van Grunsven | 2017-02-28 |
RE
Roy Antoin Bastiaan Engelen
Overall (2017): #264,863 of 506,227Top 55%
1
Patents 2017