Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786514 | Semiconductor package with sidewall-protected RDL interposer | Shing-Yih Shih | 2017-10-10 |
| 9768175 | Semiconductor devices comprising gate structure sidewalls having different angles | — | 2017-09-19 |
| 9761559 | Semiconductor package and fabrication method thereof | Shing-Yih Shih | 2017-09-12 |
| 9735161 | Memory device and fabricating method thereof | — | 2017-08-15 |
| 9704790 | Method of fabricating a wafer level package | Shing-Yih Shih | 2017-07-11 |
| 9570369 | Semiconductor package with sidewall-protected RDL interposer and fabrication method thereof | Shing-Yih Shih | 2017-02-14 |