Issued Patents 2017
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786586 | Semiconductor package and fabrication method thereof | — | 2017-10-10 |
| 9786514 | Semiconductor package with sidewall-protected RDL interposer | Tieh-Chiang Wu | 2017-10-10 |
| 9761559 | Semiconductor package and fabrication method thereof | Tieh-Chiang Wu | 2017-09-12 |
| 9761540 | Wafer level package and fabrication method thereof | — | 2017-09-12 |
| 9748184 | Wafer level package with TSV-less interposer | Hsu Chiang | 2017-08-29 |
| 9721923 | Semiconductor package with multiple coplanar interposers | — | 2017-08-01 |
| 9704790 | Method of fabricating a wafer level package | Tieh-Chiang Wu | 2017-07-11 |
| 9613895 | Semiconductor package with double side molding | — | 2017-04-04 |
| 9607967 | Multi-chip semiconductor package with via components and method for manufacturing the same | — | 2017-03-28 |
| 9576931 | Method for fabricating wafer level package | — | 2017-02-21 |
| 9570369 | Semiconductor package with sidewall-protected RDL interposer and fabrication method thereof | Tieh-Chiang Wu | 2017-02-14 |