Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9595490 | 3D system-level packaging methods and structures | Lei Shi | 2017-03-14 |
| 9548282 | Metal contact for semiconductor device | Chang-Ming Lin, Lei Shi | 2017-01-17 |
| 9543269 | System-level packaging methods and structures | Lei Shi, Honghui Wang | 2017-01-10 |