Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837371 | Structure and method of reinforcing a conductor soldering point of semiconductor device | Haizhong Shi, Jing-Lung Wu | 2017-12-05 |
| 9543269 | System-level packaging methods and structures | Yujuan Tao, Lei Shi | 2017-01-10 |