Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9736947 | Nano-copper via fill for enhanced thermal conductivity of plated through-hole via | Mark Bergman, Joan K. Vrtis | 2017-08-15 |
| 9723713 | Flexible printed circuit board hinge | Joan K. Vrtis, Mark Bergman, Shurui Shang | 2017-08-01 |
| 9659478 | Wearable electronic stress and strain indicator | Mark Bergman | 2017-05-23 |
| 9565748 | Nano-copper solder for filling thermal vias | — | 2017-02-07 |
| 9560746 | Stress relief for rigid components on flexible circuits | Mark Bergman | 2017-01-31 |
| 9549463 | Rigid to flexible PC transition | Joan K. Vrtis, Mark Bergman, Shurui Shang | 2017-01-17 |