Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9736947 | Nano-copper via fill for enhanced thermal conductivity of plated through-hole via | Mark Bergman, Michael James Glickman | 2017-08-15 |
| 9723713 | Flexible printed circuit board hinge | Michael James Glickman, Mark Bergman, Shurui Shang | 2017-08-01 |
| 9661743 | Flexible circuit board and method of fabricating | Mark Bergman | 2017-05-23 |
| 9549463 | Rigid to flexible PC transition | Michael James Glickman, Mark Bergman, Shurui Shang | 2017-01-17 |