Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9601354 | Semiconductor manufacturing for forming bond pads and seal rings | Douglas M. Reber, Phuc M. Nguyen | 2017-03-21 |
| 9548266 | Semiconductor package with embedded capacitor and methods of manufacturing same | Phuc M. Nyugen, Douglas M. Reber | 2017-01-17 |