Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754833 | Method for manufacturing semiconductor chip that includes dividing substrate by etching groove along cutting region of substrate combined with forming modified region by laser irradiating along cutting region in substrate | Takahiro Hashimoto, Kenichi Ono, Michiaki Murata, Tsutomu Otsuka | 2017-09-05 |