Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754833 | Method for manufacturing semiconductor chip that includes dividing substrate by etching groove along cutting region of substrate combined with forming modified region by laser irradiating along cutting region in substrate | Takahiro Hashimoto, Kenichi Ono, Michiaki Murata, Hideyuki Ikoma | 2017-09-05 |
| 9673351 | Method of manufacturing semiconductor chips | Takeshi MINAMIRU, Michiaki Murata, Kenji Yamazaki | 2017-06-06 |