Issued Patents 2017
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9833855 | Method for manufacturing power module substrate | Nobuyuki Terasaki | 2017-12-05 |
| 9807865 | Substrate for power modules, substrate with heat sink for power modules, and power module | Nobuyuki Terasaki, Yoshirou Kuromitsu | 2017-10-31 |
| 9786577 | Power module substrate, heat-sink-attached power-module substrate, and heat-sink-attached power module | Nobuyuki Terasaki | 2017-10-10 |
| 9764416 | Power module substrate, heat-sink-attached power module substrate, and heat-sink-attached power module | Toshiyuki Nagase, Nobuyuki Terasaki | 2017-09-19 |
| 9735085 | Bonded body, power module substrate, power module and method for producing bonded body | Nobuyuki Terasaki | 2017-08-15 |
| 9723707 | Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate | Nobuyuki Terasaki, Yoshirou Kuromitsu | 2017-08-01 |
| 9693449 | Power module substrate, power module substrate with metal part, power module with metal part, method for producing power module substrate, and method for producing power module substrate with metal part | Shuji Nishimoto | 2017-06-27 |
| 9648737 | Bonded body and power module substrate | Nobuyuki Terasaki | 2017-05-09 |
| 9642275 | Power module | Touyou Ohashi, Toshiyuki Nagase, Yoshirou Kuromitsu | 2017-05-02 |
| 9560755 | Bonding body, power module substrate, and heat-sink-attached power module substrate | Nobuyuki Terasaki | 2017-01-31 |