Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9764416 | Power module substrate, heat-sink-attached power module substrate, and heat-sink-attached power module | Yoshiyuki Nagatomo, Nobuyuki Terasaki | 2017-09-19 |
| 9715263 | BMC processing circuit, USB power delivery controller, BMC reception method, and non-transitory computer readable medium storing BMC reception program | — | 2017-07-25 |
| 9642275 | Power module | Touyou Ohashi, Yoshiyuki Nagatomo, Yoshirou Kuromitsu | 2017-05-02 |