Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9786612 | Methods of processing wafer-level assemblies to reduce warpage, and related assemblies | Aibin Yu, Wei Zhou, Zhaohui Ma | 2017-10-10 | $13,864,000 |
| 9589933 | Methods of processing wafer-level assemblies to reduce warpage, and related assemblies | Aibin Yu, Wei Zhou, Zhaohui Ma | 2017-03-07 | $20,673,000 |