Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786612 | Methods of processing wafer-level assemblies to reduce warpage, and related assemblies | Wei Zhou, Zhaohui Ma, Bret K. Street | 2017-10-10 |
| 9786643 | Semiconductor devices comprising protected side surfaces and related methods | Zhaohui Ma, Wei Zhou, Chee Chung So, Soo Loo Ang | 2017-10-10 |
| 9716019 | Semiconductor die assemblies with heat sink and associated systems and methods | Wei Zhou, Zhaohui Ma | 2017-07-25 |
| 9589933 | Methods of processing wafer-level assemblies to reduce warpage, and related assemblies | Wei Zhou, Zhaohui Ma, Bret K. Street | 2017-03-07 |