Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812380 | Bumps bonds formed as metal line interconnects in a semiconductor device | Greg Dix, Harold Kline | 2017-11-07 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812380 | Bumps bonds formed as metal line interconnects in a semiconductor device | Greg Dix, Harold Kline | 2017-11-07 |