HK

Harold Kline

MI Microchip Technology Incorporated: 1 patents #37 of 107Top 35%
Overall (2017): #408,304 of 506,227Top 85%
1
Patents 2017

Issued Patents 2017

Patent #TitleCo-InventorsDate
9812380 Bumps bonds formed as metal line interconnects in a semiconductor device Greg Dix, Roger Melcher 2017-11-07