Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818727 | Semiconductor package assembly with passive device | Che-Hung Kuo, Che-Ya Chou | 2017-11-14 |
| 9564395 | Bonding pad arrangment design for multi-die semiconductor package structure | Hsing-Chih Liu, Chia-Hao Yang | 2017-02-07 |