Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9564395 | Bonding pad arrangment design for multi-die semiconductor package structure | Chia-Hao Yang, Ying-Chih Chen | 2017-02-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9564395 | Bonding pad arrangment design for multi-die semiconductor package structure | Chia-Hao Yang, Ying-Chih Chen | 2017-02-07 |