Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812429 | Interconnect structures for assembly of multi-layer semiconductor devices | Rabindra N. Das, Pascale Gouker, Leonard M. Johnson, Ryan C. Johnson | 2017-11-07 |
| 9786633 | Interconnect structures for fine pitch assembly of semiconductor structures and related techniques | Rabindra N. Das, Peter G. Murphy, Karen E. Magoon, Noyan Kinayman, Michael J. Barbieri +1 more | 2017-10-10 |
| 9780075 | Interconnect structures for assembly of multi-layer semiconductor devices | Rabindra N. Das, Donna-Ruth W. Yost, Chenson K. Chen, Keith Warner, Steven A. Vitale +1 more | 2017-10-03 |