Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812429 | Interconnect structures for assembly of multi-layer semiconductor devices | Mark A. Gouker, Pascale Gouker, Leonard M. Johnson, Ryan C. Johnson | 2017-11-07 |
| 9786633 | Interconnect structures for fine pitch assembly of semiconductor structures and related techniques | Peter G. Murphy, Karen E. Magoon, Noyan Kinayman, Michael J. Barbieri, Timothy M. Hancock +1 more | 2017-10-10 |
| 9780075 | Interconnect structures for assembly of multi-layer semiconductor devices | Donna-Ruth W. Yost, Chenson K. Chen, Keith Warner, Steven A. Vitale, Mark A. Gouker +1 more | 2017-10-03 |
| 9756724 | Method of making a circuitized substrate | Kostas Papathomas, Voya R. Markovich | 2017-09-05 |