Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728935 | Chip-scale package and semiconductor device assembly | Kong Weng Lee, Jay A. Skidmore, Jihua Du | 2017-08-08 |
| 9729853 | Low profile depth camera | Bryed Billerbeck, James Yonghong Guo, An-Chun Tien, Ferdinand Mendoza | 2017-08-08 |