Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728935 | Chip-scale package and semiconductor device assembly | Kong Weng Lee, Vincent V. Wong, Jay A. Skidmore | 2017-08-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728935 | Chip-scale package and semiconductor device assembly | Kong Weng Lee, Vincent V. Wong, Jay A. Skidmore | 2017-08-08 |