Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659838 | Integration of chip level micro-fluidic cooling in chip packages for heat flux removal | Daniel W. Harris, John Ditri, Joseph W. Hahn | 2017-05-23 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659838 | Integration of chip level micro-fluidic cooling in chip packages for heat flux removal | Daniel W. Harris, John Ditri, Joseph W. Hahn | 2017-05-23 |