Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659838 | Integration of chip level micro-fluidic cooling in chip packages for heat flux removal | John Ditri, Joseph W. Hahn, Michael K. McNulty | 2017-05-23 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659838 | Integration of chip level micro-fluidic cooling in chip packages for heat flux removal | John Ditri, Joseph W. Hahn, Michael K. McNulty | 2017-05-23 |