Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9793103 | Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device | Hyun Jee Yoo, Dong Han Kho, Jang Soon Kim, Hyo-Soon PARK, Hyo Sook Joo | 2017-10-17 |
| 9695345 | Dicing die bonding film having excellent burr property and reliability and semiconductor device using the same | Hyun Jee Yoo, Jang Soon Kim, Hyo-Soon PARK, Dong Han Kho | 2017-07-04 |
| 9659763 | Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device | Hyun Jee Yoo, Dong Han Kho, Jang Soon Kim, Hyo-Soon PARK, Hyo Sook Joo | 2017-05-23 |