Issued Patents 2017
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9803112 | Pressure sensitive adhesive film and method of manufacturing organic electronic device using the same | Suk Ky Chang, Yoon Gyung Cho, Kyung Yul Bae | 2017-10-31 |
| 9806293 | Encapsulation film | Yoon Gyung Cho, Suk Ky Chang, Jung Sup Shim, Seung Min Lee | 2017-10-31 |
| 9806287 | Encapsulation film and method for encapsulating organic electronic device using same | Hyun Suk Kim, Suk Ky Chang, Seung Min Lee, Jung Ok Moon | 2017-10-31 |
| 9793103 | Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device | Dong Han Kho, Jang Soon Kim, Hyo-Soon PARK, Jong Wan Hong, Hyo Sook Joo | 2017-10-17 |
| 9768386 | Composition for encapsulation film, encapsulation film, and electronic device comprising the same | Jung Sup Shim, Yoon Gyung Cho, Suk Ky Chang, Seung Min Lee, Kyung Yul Bae | 2017-09-19 |
| 9698379 | Encapsulation film | Yoon Gyung Cho, Suk Ky Chang, Jung Sup Shim, Seung Min Lee | 2017-07-04 |
| 9695345 | Dicing die bonding film having excellent burr property and reliability and semiconductor device using the same | Jang Soon Kim, Jong Wan Hong, Hyo-Soon PARK, Dong Han Kho | 2017-07-04 |
| 9698378 | Encapsulation film | Yoon Gyung Cho, Suk Ky Chang, Jung Sup Shim, Seung Min Lee | 2017-07-04 |
| 9659763 | Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device | Dong Han Kho, Jang Soon Kim, Hyo-Soon PARK, Jong Wan Hong, Hyo Sook Joo | 2017-05-23 |
| 9577214 | Adhesive film and method of encapsulating organic electronic device | Yoon Gyung Cho, Seung Min Lee, Suk Ky Chang, Jung Sup Shim | 2017-02-21 |
| 9548473 | Method of evaluating reliable life span of encapsulant film and device for evaluating reliability of said film | Seung Min Lee, Yoon Gyung Cho, Kyung Yul Bae, Jung Sup Shim, Suk Ky Chang +4 more | 2017-01-17 |