Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9822460 | Methods and apparatuses for electroplating and seed layer detection | Steven T. Mayer | 2017-11-21 |
| 9809898 | Electroplating and post-electrofill systems with integrated process edge imaging and metrology systems | James E. Duncan | 2017-11-07 |